fairchildsemi.com dual cool ? package powertrench ? mosfet s dual cool ? packaging technology, provides both bottom- and top-side cooling in a pqfn package. not only is the pqfn footprint an industry standard, it provides the designer with performance fexibility. with enhanced dual path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with dual cool packaging technology provides even more impressive results. test results prove that, when a heat sink is used with our dual cool package technology, synchronous buck converters deliver higher output current and increased power density. with fairchilds trench silicon technology, dual cool packaging technology proves to be a clear leader in power density and thermal performance. our dual cool package solutions are lead free and rohs compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm pqfn packages. applications ? point-of-load (pol) synchronous-buck conversion ? servers ? telecommunications, routing and switching ? heat path from top only features ? top-side cooling, lower thermal resistance from junction to top ? same land pattern as 5 mm x 6 mm and 3.3 mm x 3.3 mm pqfn C jedec standard ? allows higher current and power dissipation ? highest power density for dc-dc applications ? use with or without a heat sink, reduces the number of qualifed components in the bom ? multiple suppliers without cross licensing requirements ? high degree of production commonality with standard pqfn packaging ? 25 v - 150 v portfolio dual cool package 3.3mm x 3.3mm standard pqfn 3.3mm x 3.3mm maximum power dissipation capable of >60% better thermal per formance power loss (w) t j max. = 90c, t a =50c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 air flow = 200lfm no air flow 5mm x 6mm package interconnect q ja (c/w) (%) improvement from wire package pqfn wire 27.1 - pqfn clip 23.8 13.9 dual cool package 17.2 57.5 to p bottom 3.3 mm x 3.3 mm & 5 mm x 6 mm environment: minimum pad, heat sink, 200lfm forced air
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